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TLP2451
TOSHIBA Photocoupler GaAAs IRED + Photo IC
TLP2451
3.95 0.25
Industrial Inverter MOSFET / IGBT Gate Driver IH (Induction Heating) Operate at high ambient temperatures up to 125C
The Toshiba TLP2451 consists of GaAAs infrared right emitting diodes and integrated high gain, high-speed photodetectors. The TLP2451 is housed in the SO8 package. The photodetector has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 15 kV/s. TLP2451 is suitable for direct gate driving circuit for IGBTs or power MOSFETs.
Unit: mm
8 7 6 5
1
2
3
4 6.0 0.2 0.1 0.1 2.5 0.2
5.1 0.2
Buffer logic type (Totem pole output) Package type: SO8 Peak Output Current : IOP = 0.6A (max) Guaranteed performance over temperature: -40 to 125C Power supply voltage: 10 to 30 V Threshold Input Current: IFLH = 5.0 mA (max) Propagation delay time: tpLH/tpHL = 700ns (max) Common mode transient immunity: 15kV/s min Isolation voltage: 3750Vrms (min) UL under application: UL1577, File No.E67349
1.27 0.15 0.38
0.305 min
11-5K1
JEDEC JEITA TOSHIBA 11-5K1 weight: 0.11 g (typ)
c-UL under application: CSA Component Acceptance Service No. 5A, File No.E67349 Option(V4) VDE under application : EN60747-5-2
Pin Configuration (Top View)
(Note) When a EN60747-5-2 approved type is needed, Please designate the "option(V4)" 1 2 8 7 6 5
SHIELD
Schematic
(M1) IF 2+ VF 3- (M2) IO 6 VO 5 GND ICC 8 VCC
3 4
1:NC 2:ANODE 3:CATHODE 4:NC 5:GND 6:VO(Output) 7:NC 8:VCC
Truth Table
Input H L LED ON OFF M1 ON OFF M2 OFF ON Output H L
SHIELD
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TLP2451
Absolute Maximum Ratings (Ta = 25 C)
Characteristic Forward Current Forward Current Derating LED (Ta 110C) (Note 1) (Ta 110C) Symbol IF IF /C IFPT IFPT /C VR IOPH IOPL VO VCC PO (Ta 110C) PO /C Topr Tstg (10 s) (Note 3) Tsol BVs Rating 25 -0.67 50 -1.34 5 -0.6 0.6 35 35 80 -2.0 -40 to 125 -55 to 150 260 3750 Unit mA mA/C mA mA/C V A A V V mW mW/C C C C Vrms
Peak Transient Forward Current
Peak Transient Forward Current Derating Reverse Voltage "H" Peak Output Current (Note2) "L" Peak Output Current (Note2) Detector Output Voltage Supply Voltage Output Power Dissipation Output Power Dissipation Derating Operating Temperature Range Storage Temperature Range Lead Soldering Temperature
Isolation Voltage (AC,1 min.,R.H. 60%)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width 1ms, duty=50%. Note 2: Exponential waveform pulse width PW 2 s, f 10 kHz Note 3: This device is regarded as a two terminal device: pins 1, 2, 3 and 4 are shorted together, as are pins 5, 6, 7 and 8.
Recommended Operating Conditions
Characteristic Input Current, High Level (Note 4) Input Voltage, Low Level Supply Voltage* Peak output current Operating Temperature Symbol IFLH VFHL VCC IOPH/ IOPL Topr Min 7.5 0 10 -40 Typ. Max 15 0.8 30 0.2 125 Unit mA V V A C
* This item denotes operating range, not meaning of recommended operating conditions. Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. Note 4: Input signal rise time (fall time) < 0.5 s. Note 5: A steep rising slope of the VCC may cause an unstable operation of the device. Therefore please design the VCC rise slope under 3.0 V/s.
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TLP2451
Electrical Characteristics (Ta = -40 to 125 C, unless otherwise specified)
Characteristics Forward voltage Temperature coefficient of forward voltage Input reverse current Input capacitance "H" Level (Note 6) Symbol VF VF/Ta IR CT IOPH1 IOPH2 IOPL1 IOPL2 VOH VOL ICCH ICCL IFLH VFHL VCC Test Circuit 1 Test Condition IF = 10 mA, Ta = 25 C IF = 10 mA VR = 5 V, Ta = 25 C V =0 V, f = 1 MHz VCC = 15 V IF = 5 mA VCC = 15 V IF = 0 mA V8-6 = 4 V V8-6 = 10 V V6-5 = 2 V V6-5 = 10 V IO = -100 mA, IF = 5 mA IO = 100 mA, VF = 0.8 V Min 1.40 0.2 0.4 6.0 0.8 10 Typ.* 1.57 -1.8 60 -0.4 0.5 8.5 0.35 1.1 1.1 1.2 Max 1.80 10 -0.2 -0.4 V 1.0 2.0 2.0 5 30 mA mA V V A Unit V mV/C A pF
Output current
"L" Level "H" Level
2 3
Output voltage "L" Level Supply current Threshold input current Threshold input voltage Supply voltage "H" Level "L" Level LH HL 4 5 6
VCC = 10 V
VCC = 10 to 30 V IF = 10 mA VO=Open IF = 0 mA VCC = 15 V, VO > 1 V VCC = 15 V, VO < 1 V
*All typical values are at Ta=25C, VCC=10 V unless otherwise specified
Note 6: Duration of Io time 50 s, 1 pulse Note 7: This product is more sensitive than conventional products to electrostatic discharge (ESD) owing to its low power consumption design. It is therefore all the more necessary to observe general precautions regarding ESD when handling this component.
Isolation Characteristics (Ta = 25 C)
Characteristic Capacitance input to output Isolation resistance Symbol CS RS Test Condition VS = 0 V , f = 1MHz R.H. 60 %, VS = 500 V AC, 1 minute Isolation voltage BVS AC, 1 second, in oil DC, 1 minute, in oil (Note 3) Min
12
Typ. 0.8 10
14
Max
Unit pF Vrms Vd c
(Note 3) 1x10
3750
10000 10000
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TLP2451
Switching Characteristics (Ta = -40 to 125 C, unless otherwise specified)
Characteristics LH HL Symbol tpLH tpHL tr tf | tpHL-tpLH | CMH 8 CML 7 VCC = 30 V Rg = 47 Cg = 3 nF Test Circuit Test Condition IF = 0 5 mA IF = 5 0 mA IF = 0 5 mA IF = 5 0 mA IF = 0 , 5 mA IF = 5 mA VCM =1000 Vp-p V O (min) = 26 V VCC = 30 V IF = 0 m Ta = 25 C VO (max) = 1 V Min 100 100 -15 15 Typ.* 50 50 Max 700 700 500 kV/s ns Unit
Propagation delay time Output rise time (10-90 %) Output fall time (90-10 %) Switching time dispersion between ON and OFF
Common mode transient immunity at HIGH level output Common mode transient immunity at LOW level output
( * ): All typical values are at Ta = 25 C. Note 8: A ceramic capacitor (0.1 F) should be connected from pin 8 (VCC) to pin 5 (GND) to stabilize the operation of the high gain linear amplifier. Failure to provide the bypass may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm.
Test Circuit 1: IOPH
1 IF 4 5 8 V8-6 A IOPH 0.1F VCC
Test Circuit 2: IOPL
1 8 0.1F IOPL A 4 5 V6-5 VCC
Test Circuit 3: VOH
1 8 VO V IO 0.1F 4 5 VCC
Test Circuit 4: VOL
1 VF IO 4 5 VOL V 8 0.1F VCC
IF
*VOH =VCCVO
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TLP2451
Test Circuit 5: ICCH
8 ICCH A 0.1F 4 5 VCC 1
Test Circuit 6: ICCL
8 ICCL A 0.1F 4 5 VCC
1 IF
Test Circuit 7: tpLH, tpHL, tr, tf, |tpLH, tpHL|
IF=5mA(P.G) (f=25kHz , duty=50%, tr = tf = less than 5ns) 1 P.G. VO IF monitor
Cg =3 nF
8 0.1F VCC IF tr tf VOH 90% 50% 10% tpLH tpHL VOL
Rg = 47
VO
4 RIN=100
5
Test Circuit 8: CMH, CML
1 SW A IF B 4 + VCM - 5 8 0.1F VO VCC
VCM
10% tr 90% tf
1000V
SW : A(IF=5mA)
CMH 1V 26V CML
VO
SW : B(IF=0mA)
800(V ) CM = L t ( s) r
CM
H
=
800(V ) t f ( s)
CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with the output voltage in the low (high) state.
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TLP2451
PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING & GENERAL STORAGE (1) Precautions for Soldering
1) When Using Soldering Reflow
An example of a temperature profile when Sn-Pb eutectic solder is used:
This profile is based on the device's maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.
An example of a temperature profile when lead(Pb)-free solder is used:
This profile is based on the device's maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.
Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) Apply preheating of 150 deg.C for 60 to 120 seconds. Mounting condition of 260 deg.C or less within 10 seconds is recommended. Flow soldering must be performed once 3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds not exceeding 350 deg.C. Heating by soldering iron must be only once per 1 lead
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TLP2451
(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) When transportation or storage of devices, follow the cautions indicated on the carton box. 3) The storage area temperature should be kept within a temperature range of 5 degree C to 35 degree C, and relative humidity should be maintained at between 45% and 75%. 4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions. 5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) When repacking devices, use anti-static containers. 7) Do not apply any external force or load directly to devices while they are in storage. 8) If devices have been stored for more than two years, even though the above conditions have been followed, it is recommended that solderability of them should be tested before they are used.
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TLP2451
Specification for Embossed-Tape Packing (TP) for SO8 Coupler
1. Applicable Package
Package SO8 Product Type Photocoupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example)
TLP2451 (TP) Tape type Device name
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
Figure 1 Device Orientation 3.2 Tape Packing Quantity: 2500 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table 1 Empty Device Recesses
Standard Occurrences of 2 or more successive empty device recesses Single empty device recesses Remarks Within any given 40-mm section of tape, not including leader and trailer Not including leader and trailer
0
6 devices (max) per reel
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape.
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TLP2451
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2.
+0.1 0.3 0.05 1.5 -0 F E D K0 1.6 0.1 A 3.3 0.1 Unit: mm Unless otherwise specified: 0.1 Symbol A B D E F G K0 Dimension 6.5 5.6 5.5 1.75 8.0 4.0 3.1 Remark Center line of indented square hole and sprocket hole Distance between tape edge and hole center +0.1 Cumulative error -0.3 (max) per 10 feed holes Cumulative error +0.1 (max) per 10 feed holes -0.3 Internal space 12.0 0.3 B G
Figure 2 Tape Forms Table 2 Tape Dimensions
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TLP2451
3.6 Reel
(1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
C
U E
B
W1 W2
Figure 3 Reel Form Table 3 Reel Dimensions
Unit: mm Symbol A B C E U W1 W2 Dimension 330 2 80 1 13 0.5 2.0 0.5 4.0 0.5 13.5 0.5 17.5 1.0
4. Packing
Either one reel or five reels of photocoupler are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example)
TLP2451 (TP) 2500 pcs Quantity (must be a multiple of 2500) Tape type Device name
A
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TLP2451
RESTRICTIONS ON PRODUCT USE
* Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
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